PLATING SERVICES

PICK UP PLATINGS

gold tin alloy plating

Gold-Tin Alloy plating

as lead-free solder for high-strength and high-reliability connection under high-temperature

indium plating

Indium plating

has low melting point, good water-resistant, good alkali-resistant, good organic acid resistant

reflow tin plating

Tin Reflow plating

in order to suppress the generation of whiskers, perform reflow processing after the plating process

high reflective gold plating

High reflective Gold plating

a special gold plating with high reflectance in 650-850nm wavelength region employed by NASA

rhodium plating

Rhodium plating

has brilliant reflective, excellent wear resistance, low electrical resistance, high corrosion resistance

hard gold plating

Hard Gold plating

wear-resistant gold plating for sliding contact surface, content of cobalt is little, hardness is Hk200~250

electroless gold plating

Electroless Gold plating

a thin gold plating on the nickel surface, plating thickness is less than 0.05μm

matte gold plating

Matte Gold plating

a soft gold deposit which closes to the characteristics of the gold, purity 99.9% or more

pure palladium plating

Pure Palladium plating

pure palladium plating for electronic parts such as the general switch component connector parts

bright gold plating

Bright Gold plating

a high purity gold material and has good corrosion-resistance and good acid-resistance properties

direct gold plating to SUS

Direct Gold plating on SUS

avoid a nickel allergy due to no nickel as the under layer with high corrosion and heat resistance

reel to reel gold plating

Reel-to-Reel Gold plating

our reel-to-reel gold plating enables the partial depo-sition and is contributed to the cost reduction

FEATURES OF MITSUYA

Company Profile

This is a video of Mituya's company profile. (Regeneration time 2 miniutes 52 seconds) Introduction the production flow and processing method of plating.

company profile page >

Gold-Tin alloy plating

The left movie shows the result of Mitsuya gold-tin plating deposit by DTA. You can see the melting vividly and dramatically at eutectic point. (47sec.)

details about this plating >

LATEST NEWS

2024.06.12General
Mitsuya Kofu Plant Tour
2024.05.28General
Introduction to Mitsuya's Certifications
2024.05.21General
Notice of Information Update
2024.05.02Exhibition
Exhibiting at Surface Technology Germany
2024.04.22General
Notice of Golden Week Holiday
2024.04.16General
Client Visit Spotlight: Strengthening Ties in the Philippines
2024.03.19Exhibition
Mitsuya's Overseas Section at APEC 2024!
2024.03.08Plating
Electrolytic and Electroless Plating on Ti Substrate
2024.02.15Exhibition
Mitsuya's Marketing Department at SURTECH 2024
2024.01.23Plating
CoNi Barrel Plating is Now Possible at Mitsuya Co., Ltd.!
2024.01.08General
Happy New Year from Mitsuya's Marketing Department
2023.12.15Plating
AuSn Barrel Plating is Available at Mitsuya Co., Ltd.!
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