Platings > Pure Palladium Plating

Pure Palladium Plating

sample of Pure Palladium Plating

Pure palladium plating deposit is used for electronic parts such as the general switch component connector parts because it has non-magnetic, high electric conductivity and good solderability characteristics.
It is known that there is a large improvement in the heat resistance, the contact resistance and the solderability, when the palladium is plated on the nickel plated part with under 0.1micrometer thickness.
It is also used as an under layer of gold plating. The barrel, the hoop and the rack plating type are all available. The hardness is about Hv200.

Functional property

  • Abrasion & Wear Resistance
  • Hardness
  • Non-Magnetic

Industry employed

  • Electronics

Availability details

mass production yes
process type B,R,M,H
under plating Ni,st.Au
prototype yes
experimental trial yes
regular chemical stock yes
B:barrelR:rackM:mesh basketH:reel to reel
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