Platings > Silver+Antimony Multilayer Plating

Silver+Antimony Multilayer Plating

Silver-Antimony (Ag-Sb) multilayer solder plating is engineered for applications requiring robust and dependable performance in elevated temperature environments. This advanced plating solution provides key advantages over traditional high-temperature solders.

・High melting point of 504.7℃
・Maintains joint integrity under thermal stress
・Resists thermal fatigue and creep.
・Offers resistance to vibration and shock.
・Multilayer design enables precise control of Silver and Antimony distribution.

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