Platings > Silver+Bismuth Multilayer Plating

Silver+Bismuth Multilayer Plating

Silver + Bismuth (Ag+Bi) multilayer solder plating is designed for applications demanding the highest levels of reliability and performance under extreme thermal conditions. This advanced plating solution offers significant advantages over conventional high-temperature solders.

・Multilayer minimizes thermal stress
・Resists fatigue, creep, and corrosion
・Resists vibration and shock
・Multilayer optimizes Ag/Bi distribution




Functional property

  • High Temperature Solder

Industry employed

  • Automotive
  • Aerospace
  • Electronics
  • Communication

Availability details

mass production yes
process type ※ B,R,M
under plating
prototype yes
experimental trial yes
regular chemical stock no
※
B:barrelR:rackM:mesh basketH:reel to reel

Recommended platings

Gold-Tin (AuSn) Alloy Plating (MC-12GT)
Tin-Antimony Alloy Plating
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