Plating Corner > Plating Methods

Plating Methods

Different Plating Methods

Plating Techniques can be broadly divided into DRY PLATING and WET PLATING depending on the process. Each technique has its own advantages, and the appropriate method is selected depending on the material and purpose being used.

Dry Plating

DRY PLATING is a technique that deposits metal in a vacuum or gas. This type of plating is applied using physical and chemical methods without using a liquid. Examples include hot-dip plating, PVD (physical vapor deposition), and CVD (chemical vapor deposition).

・Hot-dip plating
Hot-dip plating is a plating technique in which metal is melted and the base material is immersed in the molten metal. Zinc plating and aluminum plating fall into this category. This method creates a strong film on the metal surface and is used to particularly improve corrosion resistance.

・PVD (Physical Vapor Deposition)
PVD (Physical Vapor Deposition) is a technology in which metal is evaporated at high temperatures and the vapor is condensed on the surface of a substrate in a vacuum. PVD includes methods such as vacuum deposition, sputtering, and ion plating, and is characterized by the fact that it can be processed at relatively low temperatures (200-600°C), resulting in minimal thermal impact on the material. The films obtained using this method are very hard and have excellent wear and heat resistance, making them widely used in machine parts and tools.

・CVD (Chemical Vapor Deposition)
CVD (Chemical Vapor Deposition) is a method of depositing metals on a substrate surface through a chemical reaction in a gas. It is widely used in the semiconductor industry, where it can produce extremely uniform, high-quality thin films. There are various types of CVD, such as "thermal CVD," which uses heat, and "plasma CVD," which uses plasma, and they are used according to the purpose and material.

Wet Plating

WET PLATING is a technique that deposits metal onto the surface of a substrate using an electrolytic or chemical reaction. As the name suggests, it is characterized by an electrolytic or chemical reaction occurring in a liquid. Electroplating and electroless plating apply to this type of technology.

・Electroplating
Electroplating is the most widely used plating method, and uses a solution containing metal ions as the plating solution, forming a metal film on the surface of the base material by passing electricity through it. The metal ions are reduced on the base material surface under the influence of the electric current, causing the metal to deposit. This allows for uniform, high-precision plating. It is mainly used for purposes such as decoration, improving corrosion resistance, and improving conductivity.


・Electroless Plating
Electroless plating is a technology that uses chemical reactions to deposit metals onto the surface of a substrate without using electricity. Electroless nickel plating is a typical example, and is widely used in electronic devices and aircraft parts, among other applications, as it forms a uniform, highly corrosion-resistant film.

Back to plating corner top
page top