Solutions > Nickel plating (metallization) for wire bonding

Solution - Nickel plating (metallization) for wire bonding

In company A, the metal substrate mounted sensor chips was connected to the base-plate (frame) by aluminum wire bonding. However, the bonding strength was weak, so the yield was low.
We recommended adopting our established nickel plating for wire bonding. We and company A produced the sample experimentally and evaluated it. As a result, the yield of the device improved nearly 100%. In addition, our plating is proceed by the reel-to-reel type, we have achieved the overall cost reduction.


  • Quality improvement
  • Cost reduction
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