Platings > Low Phosphorus Electroless Nickel Plating
Low Phosphorus Electroless Nickel Plating
We provide electroless nickel plating with very low phosphorus content (1-3 mass%).
This plating deposit has some advantageous properties such as high hardness (700 Hv as deposited), low resistivity (30-60 μΩcm) and excellent adhesive to ITO.
Functional property
- Low Contact Resistance
- Sealability
- Wire Bondability
Availability details
| mass production | no |
|---|---|
| process type ※ | R,M |
| under plating | - |
| prototype | yes |
| experimental trial | yes |
| regular chemical stock | yes |
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- B:barrelR:rackM:mesh basketH:reel to reel
Mail Form
+81-3-6421-7197
