Platings > Electroless Nickel Plating/Metallization (containing Boron)

Electroless Nickel Plating/Metallization (containing Boron)

Electroless nickel-boron plating is used for the under layer for ceramic substrate circuits and the parts that require soldering.
The purity of nickel for electroless nickel-boron can be higher than the electroless nickel-phosphorus deposit.
Precious metals such as gold is plated on the electroless nickel-boron plating, whenever required. Electroless nickel-boron which has low content boron (high-purity nickel) shows magnetic (ferromagnetic) property.
This plating is employed on analytical instruments.

Functional property

  • Good Bondability
  • Hardness
  • Corrosion Resistance

Industry employed

  • Semi-conductor (IC)

Availability details

mass production no
process type ※ R,M
under plating -
prototype yes
experimental trial yes
regular chemical stock yes
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B:barrelR:rackM:mesh basketH:reel to reel
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