Platings > Alkaline Copper Plating (metallization)

Alkaline Copper Plating (metallization)

sample of Alkaline Copper Plating (metallization)

Copper is soft and has high ductility. It is a very workable material that has good heat and electric conductive properties.

Since copper has excellent properties such as antimicrobial resistance, thermal conductivity, electrical conductivity, high frequency, solderability, bondability, contactability, low contact resistance, secondary workability and carbonizing-prevention, it is used various fields.

Copper plating is excellent for corrosion protection and adhesion for iron materials. It is usually used as the under plating for nickel, tin, silver and other platings.
This copper plating does not contain a brightener agent.

Functional property

  • High Electrical
  • High Thermal Conductivity
  • High Frequency

Industry employed

  • Communication

Max plating size

400mm x 500mm x 300mm (DxWxH)

Availability details

mass production yes
process type B,R,M
under plating -
prototype yes
experimental trial yes
regular chemical stock yes
B:barrelR:rackM:mesh basketH:reel to reel
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