Platings > Alkaline Copper Plating (metallization)
Alkaline Copper Plating (metallization)
Copper is soft and has high ductility. It is a very workable material that has good heat and electric conductive properties.
Since copper has excellent properties such as antimicrobial resistance, thermal conductivity, electrical conductivity, high frequency, solderability, bondability, contactability, low contact resistance, secondary workability and carbonizing-prevention, it is used various fields.
Copper plating is excellent for corrosion protection and adhesion for iron materials. It is usually used as the under plating for nickel, tin, silver and other platings.
This copper plating does not contain a brightener agent.
Functional property
- Electrical Conductivity
- High Thermal Conductivity
- High Frequency
Industry employed
- Communication
Max plating size
400mm x 500mm x 300mm (DxWxH)
Availability details
| mass production | yes |
|---|---|
| process type ※ | B,R,M |
| under plating | - |
| prototype | yes |
| experimental trial | yes |
| regular chemical stock | yes |
- ※
- B:barrelR:rackM:mesh basketH:reel to reel
Mail Form
+81-3-6421-7197
