Platings > Porous Copper plating
Porous Copper plating

We provide copper plating which has micro-sized holes on the surface. This plating is used as electrodes and as an under layer for painting.
The surface of our porous plating is several micro meter-size pore and 40 million/cm2 porosity.
Applications of this plating are as follows.
・Under layer for painting.
・Surface modification.
・Substrate for packaging materials.
Note: Presently, experimental trial at our technical center only.
Functional property
- Porous
Availability details
mass production | no |
---|---|
process type ※ | |
under plating | - |
prototype | no |
experimental trial | yes |
regular chemical stock | no |
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