Solutions > Gold-Tin alloy plating

Solution - Gold-Tin alloy plating

Along with the high density and low-cost of semiconductor elements, element terminal were plated by gold and one additional process was need in company C. We proposed gold-tin plating for the terminals in stead of the gold plating. Our technical department developed the plating process, and succeeded in obtaining a good adhesion and uniform thickness of this plating to enable the mass production.

Plating detail

Achievement

  • Quality improvement
  • Cost reduction
  • Providing a searched plating
  • Difficult material to be plated
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