Solution results - Individual

We would like to introduce the following solution results of the functional, quality, and cost improvement by our advanced finishing and plating technology.

Nickel plating for wire bonding

In company A, the metal substrate mounted sensor chips was connected to the base-plate (frame) by aluminum wire bonding. However, the bonding strength was weak, so the yield was low.
We recommended adopting our established nickel plating for wire bonding. We and company A produced the sample experimentally and evaluated it. As a result, the yield of the device improved nearly 100%. In addition, our plating is proceed by the reel-to-reel type, we have achieved the overall cost reduction.


  • Quality improvement
  • Cost reduction

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