Platings > Electroless Gold plating (immersing type for thin deposit)

Electroless Gold plating (immersing type for thin deposit)

sample of Electroless Gold plating (immersing type for thin deposit)

This plating is used when we need to form a thin gold plating on the nickel surface. Plating thickness is less than 0.05μm. This plating can be applied to deposit on the independent circuit pattern, because of the electroless plating type.
Features of electroless gold plating (thin) of Mitsuya is as follows.
・Good solder wettability and good joint strength
・Low temperature forming (80 ℃)
・Less damage to the under layer nickel
・Fine and uniform deposit

Functional property

  • Low Contact Resistant
  • Good Bonding & Soldering
  • High Conductive

Industry employed

  • Sensors
  • Semi-conductor

Solutions

Availability details

mass production no
process type R,M
under plating Ni-p
prototype yes
experimental trial yes
regular chemical stock yes
B:barrelR:rackM:mesh basketH:reel to reel
page top