Platings > Electroless Silver plating

Electroless Silver plating

Electroless silver plating can be deposited on the electrically independent island portion like an insular circuit pattern.
It is used in the portion required the solderability, bondability and low contact resistivity.
Plating deposit thickness is up to about 0.3μm.

Functional property

  • Low Contact Resistant
  • High Conductive

Industry employed

  • Sensors

Availability details

mass production no
process type R,M
under plating Ni-P
prototype yes
experimental trial yes
regular chemical stock no
B:barrelR:rackM:mesh basketH:reel to reel
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