Platings > Electroless Nickel plating (containing Phosphorus)

Electroless Nickel plating (containing Phosphorus)

sample of Electroless Nickel plating (containing Phosphorus)

Electroless nickel plating is a deposit by the chemical reaction, not by the electric power supply. Because the phosphoric acid compound is used as a reducing agent, this deposit is nickel-phosphorus alloy.
This plating is applied to the surface finishing of the mechanical parts or the electronic devices, because of a good corrosion resistance and good abrasion resistance. It is also applied to the parts, which avoid a magnetic, because of non-magnetic property.
This plating thickness is a good uniformity. It is able to increase the hardness by heat treatment, however the deposit is magnetized.

Functional property

  • Low Contact Resistant
  • Sealing
  • Good Bonding & Soldering

Industry employed

  • Semi-conductor

Solutions

Availability details

mass production no
process type B,R,M
under plating Ni,Cu
prototype yes
experimental trial yes
regular chemical stock yes
B:barrelR:rackM:mesh basketH:reel to reel
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