Platings > Electroless Nickel plating (containing Phosphorus)
Electroless Nickel plating (containing Phosphorus)
Electroless nickel plating is a deposit by the chemical reaction, not by the electric power supply. Because the phosphoric acid compound is used as a reducing agent, this deposit is nickel-phosphorus alloy.
This plating is applied to the surface finishing of the mechanical parts or the electronic devices, because of a good corrosion resistance and good abrasion resistance. It is also applied to the parts, which avoid a magnetic, because of non-magnetic property.
This plating thickness is a good uniformity. It is able to increase the hardness by heat treatment, however the deposit is magnetized.
Functional property
- Low Contact Resistant
- Sealing
- Good Bonding & Soldering
Industry employed
- Semi-conductor
Solutions
Availability details
| mass production | no |
|---|---|
| process type ※ | B,R,M |
| under plating | Ni,Cu |
| prototype | yes |
| experimental trial | yes |
| regular chemical stock | yes |
- ※
- B:barrelR:rackM:mesh basketH:reel to reel
