Platings > Direct Tin plating on SUS without Ni under plating

Direct Tin plating on SUS without Ni under plating

sample of Direct Tin plating on SUS without Ni under plating

We can provide the direct tin plating on SUS. You can avoid a nickel allergy because there is no nickel as the under layer and also can get high corrosion resistance and high heat resistance and good productivity.
It can keep an excellent solderability in reflow soldering at the selective tin plated area.

Functional property

  • Anti Nickel-Allergic
  • Good Bonding & Soldering
  • Low Contact Resistant

Industry employed

  • Sensors

Availability details

mass production no
process type R
under plating -
prototype no
experimental trial yes
regular chemical stock yes
B:barrelR:rackM:mesh basketH:reel to reel
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