Gold-Tin alloy plating

Gold-Tin alloy plating

We offer a plating deposit as a lead-free solder for high-temperature connection, and as a solder for high-strength and high-reliability connections.
Both rack plating and barrel plating are available.
We can provide the thinner plating deposit than sheet material or ribbon material. And we can also form the deposit on the selected portion.
The eutectic and non-eutectic compositions of gold-tin alloys plating can be provided, too.
Our gold-tin alloy plating can be applied to the parts that require high-temperature connection or high-reliability connection.

The left movie shows the result of Mitsuya gold-tin plating deposit by DTA. You can see the melting vividly and dramatically at eutectic point. (47sec.)
(* Any software to play MP4 movie file is required.)

Functional property

  • Good bonding & soldering
  • High conductive
  • Low contact resistance

Industry employed

  • Electronics components (Sensors)
  • Semi-conductors

Availability details

factory Tokyo
mass production yes yes - -
process type B R - -
under plating Ni Cu,Ni,Pd-Ni
- -
prototype yes yes - -
experimental trial yes yes - -
chemical stock
yes yes - -

process type: B(barrel) R(rack) M(mesh basket) H(reel to reel)

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