Reel-to-reel Gold and Tin-Copper alloy plating

Reel-to-reel Gold and Tin-Copper alloy plating

This plating system is useful to the quick delivery and the labor saving. By using this line, it is performed for gold reel-to-reel plating on the contact portions and tin-copper solder alloy plating on the soldering or caulking portions. Nickel plating is for the under layer.

Functional property

  • High Conductive
  • Low Contact Resistance
  • Good Bonding & Soldering

Industry employed

  • Electronics components (Sensors)
  • Electronics components (High precision connectors)
  • Electronics components (Switches)

Availability details

factory Tokyo
Gotanda
Tokyo
Hachioji
Yamagata
Yonezawa
Yamanashi
Kofu
mass production - - - yes
process type - - - H
under plating - - - Ni
prototype - - - yes
experimental trial - - - yes
regular
chemical stock
- - - yes

process type: B(barrel) R(rack) M(mesh basket) H(reel to reel)


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