Electroless Gold plating (immersing type for thin deposit)

Electroless Gold plating  (immersing type for thin deposit)

This plating is used when we need to form a thin gold plating on the nickel surface. Plating thickness is less than 0.05μm. This plating can be applied to deposit on the independent circuit pattern, because of the electroless plating type.
Features of electroless gold plating (thin) of Mitsuya is as follows.

  • Good solder wettability and good joint strength
  • Low temperature forming (80 ℃)
  • Less damage to the under layer nickel
  • Fine and uniform deposit

Functional property

  • Low contact resistance
  • Good bonding & soldering
  • High conductive

Industry employed

  • Electronics components (Sensors)
  • Semi-conductor

Availability details

factory Tokyo
Gotanda
Tokyo
Hachioji
Yamagata
Yonezawa
Yamanashi
Kofu
mass production yes - - -
process type R,M - - -
under plating Ni-p - - -
prototype yes - - -
experimental trial yes - - -
regular
chemical stock
yes - - -

process type: B(barrel) R(rack) M(mesh basket) H(reel to reel)


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